Electronic Component Storage Requirements

49 69 6302 407 e mail.

Electronic component storage requirements.

Imc intermetallic compound growth through to the surface destroys solderability. Can be accepted if less than 2 two years old ii. However msds present a number of challenges when used in surface mount assembly as they may suffer. His focus has been the design and application of measurement tools used to improve manufacturing thermal processes and well as moisture sensitive component storage solutions.

At that time this problem was recognized as having important logistics connotations. Component shelf life storage condition requirements for electronic suppliers uncontrolled when printed ge proprietary or page 5 of 9 transmitted electronically ga src 0003 rev. Long term storage of components subassemblies and devices published by. For logistics planning it was necessary to know what would be the failure rate of components and equipments when they were on the shelf for a long.

Escc 20600 preservation packaging and dispatch of escc electronic components. Zvei german electrical and electronic manufacturers association electronic components and systems division and pcb and electronic systems division lyoner straße 9 60528 frankfurt am main germany phone. Moisture sensitive component storage hiro suganuma alvin tamanaha seika machinery inc. We use the mil and esa procedures relevant to manage the storage process and their associated tasks.

The problem of storage of electronic parts and equipment first came into focus with the publication of the agree committee report on task 8 in 1957. Transportation and storage of electronic components. The storage of moisture sensitive electronic components and materials is problematic and manufacturers with long term storage require ments face additional obstacles. Requirements for long term storage are in creasing.

As an aerospace defense oem we have the same requirements and have implemented lts long term storage protocols to deal with it. 0 3 2 active components including semiconductors oscillators and diodes etc. Proper packaging is critical to the successful transportation of any electronic component be it moved inner city or. Following are the risks that require mitigation for electronic components.

49 69 6302 276 fax. Technician engineer manufacture and customer. Escc 24900 minimum requirements for controlling environmental contamination of components. This document outlines the transportation packaging storage and environmental requirements for all electronic components manufactured by aimtec inc.

Component obsolescence due to rapid changes in packaging design and material companies find themselves forced. The primary areas of enhancement were to the long term storage control requirements and the appendixes with guidelines for executing these requirements.